FLYING PROBE TESTER FA1813

Upper arm board alignment uses a high-resolution camera with twice the pixels as the previous model and a high-magnification lens (with 2× optical zoom) to help achieve accurate probing of the fine-pitch pads found on high-density package boards. “Probe-down with contact check,” a new function, facilitates optimal probe stroke to minimize impact marks, reducing damage to pads.

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Description

Flagship model for package board testing

Features

  • Four-terminal measurement of fine-pitch pads
  • Reduced impact marking when used with the latest probes
  • Defect analysis using Process Analyzer